Dissipation utilizing flow of refrigerant

ABSTRACT

Technologies are generally described for devices, methods, and programs for heat dissipating utilizing flow of refrigerant. An example heat dissipating device includes a conductive chamber to receive a fluid refrigerant, and the conductive chamber itself includes an evaporation portion having an interior layer and an exterior layer that is in contact with a heat generating unit, a condensation portion, and a rotatable brush that is configured inside of the conductive chamber to have an axis that is parallel to the interior layer of the evaporation portion and that is further configured to sweep across the interior layer of the evaporation portion to form a thin film of the fluid refrigerant.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation application of U.S. patentapplication Ser. No. 13/391,573, filed on Feb. 21, 2012, which is aNational Stage Application of PCT/CN2011/72909, filed Apr. 18, 2011 andis related to U.S. patent application Ser. No. 12/535,530 and U.S.patent application Ser. No. 12/535,542, both filed on Aug. 4, 2009. Theentire contents of the aforementioned related applications areincorporated herein by reference.

BACKGROUND

A consequence of large scale integrated circuit manufacturing technologyis that heat-emitting power, and flux of heat dissipation from chips, isincreasing as the size of chips is decreasing.

According to the principles of thermodynamics, heat conductivity of afluid is greater than that of air. Therefore, pipe heat dissipatingtechnologies such as water cooling have been gradually applied to highpower electronic components, e.g., CPU and GPU with varying levels ofeffectiveness.

SUMMARY

In one example, a heat dissipating device includes a conductive chamberto receive a fluid refrigerant, and the conductive chamber includes anevaporation portion having an interior layer and an exterior layer thatis in contact with a heat generating unit, a condensation portion, and arotatable brush that is configured inside of the conductive chamber tohave an axis that is parallel to the interior layer of the evaporationportion and that is further configured to sweep across the interiorlayer of the evaporation portion to form a thin film of the fluidrefrigerant.

The foregoing summary is illustrative only and is not intended to be inany way limiting. In addition to the illustrative aspects, embodiments,and features described above, further aspects, embodiments, and featureswill become apparent by reference to the drawings and the followingdetailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other features of this disclosure will become morefully apparent from the following description and appended claims, takenin conjunction with the accompanying drawings. Understanding that thesedrawings depict plural embodiments in accordance with the disclosure andare, therefore, not to be considered limiting of its scope, thedisclosure will be described with additional specificity and detailthrough use of the accompanying drawings, in which:

FIG. 1 shows a schematic sectional view of an illustrative embodiment ofa heat dissipating device for dissipation utilizing flow of refrigerant;and

FIG. 2 shows a flow diagram of an illustrative embodiment of aprocessing flow for dissipation utilizing flow of refrigerant.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings, which form a part of the description. Unlessotherwise noted, the description of successive drawings may referencefeatures from one or more of the previous drawings to provide clearercontext and a more substantive explanation of the current exampleembodiment. Still, the example embodiments described in the detaileddescription, drawings, and claims are not meant to be limiting. Otherembodiments may be utilized, and other changes may be made, withoutdeparting from the spirit or scope of the subject matter presentedherein. It will be readily understood that the aspects of the presentdisclosure, as generally described herein, and illustrated in thefigures, can be arranged, substituted, combined, separated, and designedin a wide variety of different configurations, all of which areexplicitly contemplated herein.

FIG. 1 shows a schematic sectional view of an illustrative embodiment ofa heat dissipating device 100 for dissipation utilizing flow ofrefrigerant. As depicted in FIG. 1, heat dissipating device 100 includesa heat generating unit 102 in contact with a conductive chamber 104,which includes, at least, an evaporation portion 106, a condensationportion 108, wheels 110A and 110B, a belt 112, and a brush element 114.A refrigerant 116 is injected into conductive chamber 104. Injection ofrefrigerant 116 into conductive chamber 104 is further discussed below.

Heat generating unit 102 may include an electric circuit or at least onesemiconductor chip, which may serve as a subject for cooling bydissipation utilizing a flow of refrigerant.

Heat generating unit 102 may alternatively include a multitude ofphysical structures for which heat dissipation is an effective coolingimplementation, as embodiments of dissipation utilizing flow ofrefrigerant may be implemented on varying scales. While encasing suchphysical structures may allow for more efficient and effective coolingvia heat dissipation than for physical structures that are not encased,implementations of dissipation utilizing flow of refrigerant are not solimited. Non-limiting examples of such physical structures may includeindustrial-sized motors and/or engines, which may be implemented in anyof marine, subterranean, topographic, or even atmospheric conditions. Ofcourse, as heat generating unit 102 increases or decreases in scale, sodoes conductive chamber 104 and the corresponding contents therein ascurrently described, although the scale of conductive chamber 104 andthe corresponding contents inside relative to heat generating unit 102is not necessarily in direct proportion thereto.

Conductive chamber 104 may be made of one or more materials, e.g.,metals, having thermal conductive attributes and may be configured as ahousing that is an enclosed, or substantially enclosed, hollow body thatis capable of at least isolating a gas transfer from an interior ofconductive chamber 104 to an exterior thereof. More particularly,conductive chamber 104 may be made of multiple panels for, respectively,a bottom portion, a top portion, and one or more side portions; and tothe extent that any of such portions may be in contact with heatgenerating unit 102, at least that portion may be made of theaforementioned materials having thermal conductive attributes. In thenon-limiting context of the embodiment of FIG. 1, at least the bottomportion of conductive chamber 104 is made of one or more materialshaving thermal conductive attributes.

The exterior of the conductive chamber 104 may be configured as acolumn, a multi-faced polygon, e.g., cube, cube, rhomboid, etc.Accordingly, the interior of conductive chamber 102 may be formed in,for example, a column, can be a multi-faced cube, for example, a squarecube, a rectangle, rhomboid, etc., although the interior of conductivechamber 104 does not mimic the exterior shape thereof in allembodiments.

Prior to or after heat is produced by heat generating unit 102, theinterior of conductive chamber 104 may be injected with liquidrefrigerant 116, which may effectively serve as a cooling agent for heatgenerating unit 102. A charging amount of refrigerant 116 may bedetermined according to a working temperature and a heat dissipatingpower of the heat dissipating device 100, as well as the properties ofthe refrigerant itself. Non-limiting examples of liquid refrigerant 116may include water, ammonia methanol, etc.

Evaporation portion 106 may be configured on, or as part of, a bottomportion of conductive chamber 104. That is, evaporation portion 106 maybe configured as a heat-conductive substrate that is affixed to thebottom portion in the interior of conductive chamber 104, as depicted inFIG. 1. Evaporation portion 106 may be affixed to conductive chamber 104utilizing any of a number of means, e.g., hook, latch, or screw,adhesive, or epoxy resin, so long as none of the utilized means foraffixing adversely affects the conduction of heat from heat generatingunit 102 to conductive chamber 104 and/or evaporation portion 106.Further, in at least one embodiment, evaporation portion 106 may beconfigured as part of the bottom portion in the interior of conductivechamber 104 that may or may not be configured to be entirely planar.

An upper layer of evaporation portion 106 may be configured to faceupwards, away from the bottom of conductive chamber 104, to receiveliquid refrigerant 116 and to have liquid refrigerant 116 evaporatetherefrom.

A lower layer of evaporation portion 106 may be in direct or indirectcontact with heat generating unit 102 to conduct heat away from heatgenerating unit 102.

For the lower layer of evaporation portion 106 to be in indirect contactwith heat generating unit 102, evaporation portion 106 may beconfigured, as set forth above, as a heat-conductive substrate that isaffixed to the bottom portion in the interior of conductive chamber 104,as depicted in FIG. 1.

For the lower layer of evaporation portion 106 to be in direct contactwith heat generating unit 102, evaporation portion 106 may be configuredas part of the bottom portion in the interior of conductive chamber 104that may or may not be configured to be entirely planar. Alternatively,evaporation portion 106 may be configured as a heat-conductivesubstrate, of which the lower layer is in direct contact with an upperlayer of heat generating unit 102 through an opening in the bottomportion of conductive chamber 104.

Condensation portion 108 may be configured on, or as part of, a topportion of conductive chamber 104. That is, condensation portion 108 maybe configured as a substrate that is affixed to the top portion in theinterior of conductive chamber 104, as depicted in FIG. 1.Alternatively, condensation portion 108 may be configured as part of thetop portion in the interior of conductive chamber 104 that may or maynot be configured to be entirely planar. Although condensation portion108 may or may not be made of one or more materials having thermalconductive attributes, condensation portion 108 may be configured to bein contact with an auxiliary heat dissipating device (not shown) torelease heat collected at condensation portion 108.

Wheels 110A and 110B may be configured as one or more wheels that,regardless of quantity, are configured to have its axis at leastsubstantially parallel to evaporation portion 106. Thus, with regard toquantity, it is noted that the present description of and references towheels 110A and 110B are by way of example only as they may vary inquantity, placement, or even manner of placement inside of conductivechamber 104. Further, throughout the present description, wheels 110Aand 110B may be collectively referred to as “wheels 110,” particularlywhen describing the utility of the wheels themselves and, therefore,reference to the quantity thereof is not paramount.

Further, regardless of quantity, at least one of wheels 110 may beconsidered to be a driving wheel, i.e., power-driven by a motor, forexample. The power source for the driven one of wheels 110 may be eitherinternal or external to conductive chamber 104, and alternate sources ofpower are feasible for the embodiments described herein and contemplatedas a result.

Further still, wheels 110 may be configured so that the axis of each ofwheels 110, which may be statically affixed or dynamically adheredrelative to a side portion of conductive chamber 104 in various manners,is parallel to evaporation portion 106 and perpendicular to each other.For example, an axle that passes through the axis of a respective one ofwheel 110 may be affixed or adhered to a side portion of chamber 104utilizing any of a number of means, e.g., hook, latch, or screw,adhesive, or epoxy resin, so long as none of the utilized meansadversely affects the conduction of heat from heat generating unit 102to conductive chamber 104 and/or evaporation portion 106. In addition,example implementations of multiple wheels 110 may be configured to haveuniform dimensions, including circumference and width, for maintaininguniform rotational velocity and uniform sweeping, as will be describedfurther below.

Belt 112 includes under layer 112A and top layer 112B. That is, thepresent description of, and references to under layer 112A and top layer112B is in reference to the respective layers of the comprehensive “belt112,” to which reference may be made when general referral is sufficientfor the descriptions of the one or more embodiments presently made.

Belt 112 may be configured to have a width that is substantially similarin proportion to a width of evaporation layer 106, which may or may notbe the same as a width of conductive chamber 104. By “width,” referenceis made to a directional measurement of belt 112 in the direction of theaxes of wheels 110. In one or more embodiments, the width of belt 112may also be configured to be substantially similar in proportion to awidth of condensation layer 108, so long as the width of condensationlayer 108 is the same or less than the width of evaporation layer 106,for reasons described further below.

Belt 112 may be a porous microfiber sheath, or some other absorbentmaterial, that may be configured as a continuous, i.e., seamless, loopof which under layer 112A is capable of passing over an exterior surfaceof wheels 110. Thus, either the material of which belt 112 is made hastacky, i.e., sticky, attributes or under layer 112A may have a tackysubstance applied thereto so that under layer 112A may pass overexterior the surface of wheels 110 without slippage, as the driver oneof wheels 110, in combination with belt 112, causes all of wheels 110 toturn in a same rotational direction. Alternatively, in the absence of atacky material for belt 112 or a tacky substance applied to under layer112A, one or more of wheels 110 may have a tacky substance or mildadhesive applied thereto to cause under layer 112A to pass over theexterior surface of wheels 110 without slippage.

Belt 112 may further include top layer 112B on which brushes 114 areadhered or from which brush elements are formed.

Stem 114A may refer to a stem of brush 114 that is adhered to belt 112and that is made of a rigid or semi-rigid material, i.e., metal orplastic, to which brush element 114B is affixed. Further, stem 114A maybe retractable and/or extendable.

Alternatively, stem 114A may refer to a stem that is formed from belt112, and is therefore made of the same porous microfiber material asbelt 112. Accordingly, stem 114A and brush element 114B may be made ofthe same material in one or more embodiments.

Regardless, the present description of, and references to stem 114A andbrush element 114B is by way of example only, as they may vary inconstruction and configuration relative to belt 112. Further, throughoutthe present description, stem 114A and brush element 114B may becollectively referred to as “brush 114,” particularly when describingthe utility of the brush itself and, therefore, reference to theconstruction or configuration thereof is not paramount. Further still,FIG. 1 depicts multiple implementations of brush 114 attached to orformed from belt 112, though the embodiments of dissipation utilizingflow of refrigerant described herein are in no way restricted orlimited. Thus, unless otherwise noted, the embodiments herein may beunderstood to include one or more implementations of “brush 114,” whichmay therefore be collectively referred to as “brushes 114.” Evenfurther, implementations of wheels 110, belt 112, and one or morebrushes 114 may comprehensively be referred to as a rotatable or evenrotating brush that may transversely sweep across, at least,substantially all of a heated surface of evaporation portion 106.

Brush element 114B may refer to a wiper, scraper, or multitude ofstrands made of a porous microfiber or polyfibers that are capable ofapplying liquid refrigerant 116 along substantially an entire heatedsurface of evaporation portion 106 in a sweeping motion.

In general, the driver one of wheels 110 may drive belt 112 over all ofwheels 110 so that brushes 114 that are affixed to or formed from belt112 may, at least, uniformly spread a thin layer of liquid refrigerant116 along substantially the entire length and width, or alternativelysubstantially the entire heated surface, of evaporation portion 106.Subsequently, as evaporation portion 106 becomes a heated surface fromwhich the uniform film of liquid refrigerant 116 evaporates, refrigerant116 coagulates on condensation portion 108.

Brushes 114 may be configured to sweep along substantially an entirewidth and length of condensation portion 108, as well, to collectrefrigerant 116 to prevent any coagulation thereof from dripping ontoevaporation portion 106, thereby skewing or fluctuating the dissipationperformance of heat dissipating device 100 for heat generating unit 102.Thus, in at least one embodiment, for brushes 114 to be capable ofsweeping across both evaporation portion 106 and condensation portion108, wheels 110 may be configured identically. That is, the axis of eachof wheels 110 may be disposed at a same height above evaporation portion106 and each one of wheels 110 may be configured to have a same radius.

Alternatively, brushes 114 may be configured, or wheels 110 may bedisposed, so that brushes 114 sweep only along evaporation portion 106but not condensation portion 108. Accordingly, belt 112 may beconfigured to have width and length dimensions that are substantiallysimilar to those of condensation portion 108, so that any coagulation ofrefrigerant 116 may drip onto belt 112 and not onto evaporation portion106.

FIG. 2 shows a flow diagram of an illustrative embodiment of aprocessing flow for dissipation utilizing flow of refrigerant.Processing flow 200 may include various operations, functions, oractions, as illustrated by one or more of blocks 202, 204, 206, 208,210, and/or 212. Although illustrated as discrete blocks, various blocksmay be divided into additional blocks, combined into fewer blocks, oreliminated, depending upon a desired implementation. Processing maybegin at block 202.

In accordance with at least one example embodiment of dissipationutilizing flow of refrigerant, processing flow 100 may be described inthe context of dissipating heat produced by heat generating unit 102,e.g., electric circuit, motor, semiconductor chip.

Block 202 (Inject Refrigerant into Chamber) may include liquidrefrigerant 116 being injected into conductive chamber 104. Theinjection of liquid refrigerant 116 may be made through an opening in atop, bottom, or side portion of conductive chamber 104; or the injectionmay include pouring refrigerant 116 into conductive chamber 104 prior toor during the heating of heat generating unit 102.

Further, as set forth above, the various operations, functions, oractions associated with blocks 202, 204, 206, 208, 210, and 212 may bedivided, combined, or even eliminated depending upon an implementationof processing flow 200. Accordingly, the injection implemented at block202 may be executed in connection with operations, functions, or actionsassociated with at least blocks 204, 206, and 208, as well. That is,refrigerant 116 may be injected into conductive chamber 104 inconnection with various blocks of processing flow 200, in varying waysand even in varying quantities. Further still, the timing, quantity, andeven type of refrigerant 116 injected into conductive chamber may beinfluenced by heating patterns, i.e., timing, duration, and/ortemperature range, of heat generating unit 102. Processing may continuefrom block 202 to block 204.

Block 204 (Conduct Heat from Heat Generating Unit) may refer to the heatbeing generated by heat generating unit 102 being conducted away byconductive chamber 104 and/or evaporation portion 106, either of whichmay be in direct or indirect contact with heat generating unit 102.Processing may continue from block 204 to block 206.

Block 206 (Apply Refrigerant on Evaporation Layer by Sweeping) may referto the driving one of wheels 110 turning in a direction and at a decidedvelocity so that one or more brushes 114 associated with belt 112 mayuniformly spread a thin film of refrigerant 116 across substantially allof a heated surface of evaporation portion 106.

Again, brushes 114 may be configured to sweep along substantially anentire width and length of condensation portion 108 or at leastsubstantially the entire heated surface thereof. The number of brushesthat transversely sweep across evaporation portion 106, and even thefrequency thereof, may also be influenced by heating patterns, i.e.,timing, duration, and/or temperature range, of heat generating unit 102.Thus, at least some embodiments of brushes 114 may be configured so thatstem 114A is retractable so that not every one of brushes 114 sweepsacross evaporation portion 106 with every passage thereof.

To further exploit the retractable attribute of stem 114A in someembodiments of brushes 114, various ones of brushes 114 may be retractedand then extended as belt 112 passes over evaporation portion 106 toensure that refrigerant 116 is applied evenly over substantially allover the heated surface of evaporation portion 106. Such feature and/orfunctionality of stem 114A may be useful as the scale of heatdissipating device 100 increases in scale.

As a result of refrigerant 116 being adsorbed to the heated surface ofevaporation portion 106 as a uniform thin film, refrigerant 116 maycollect the heat and evaporate as a vapor and coagulate upon an innerlayer of condensation portion 108. The inner portion of condensationportion 108 may face the upper layer of evaporation portion 106 withbelt 112, and wheels 110 and brushes 114, thereinbetween.

That is, heat emitted by the heat generating unit 102 may transfer torefrigerant 116 inside of conductive chamber 104. Refrigerant 116 maythen evaporate from the heated surface, i.e., upper layer, ofevaporation portion 106 having absorbed the heat transferred from theevaporation portion 106. Refrigerant 116 may then be transformed as arefrigerant vapor that reaches the inner layer of condensation portion108 by dispersion, releasing heat to coagulate on the inner layer of thecondensation portion 108 and re-form as the fluid refrigerant 116. Thereleased heat may be emitted from conductive chamber 104 through anopening or auxiliary heat dissipating device connected to condensationportion 108 or elsewhere on an upper surface of conductive chamber 104.Processing may continue from block 206 to block 208.

Block 208 (Collect Coagulated Refrigerant) may refer to belt 112 and/orbrushes 114 preventing coagulated refrigerant 116 from falling onto theupper layer of evaporation portion 106, thus preventing fluctuation inthe heat dissipating performance of heat dissipating device 100.

More specifically, since the width of belt 112 may be configured to besubstantially similar in proportion to a width of condensation layer108, so long as the width of condensation layer 108 is the same or lessthan the width of evaporation layer 106, any droplets of coagulatedrefrigerant 116 may be collected onto, and absorbed by, belt 112 that ismade of a porous microfiber sheath. The collected droplets of coagulatedrefrigerant 116 may then be transferred to an attached receptacle (notshown) or otherwise recycled by, e.g., being reapplied onto evaporationportion 106 by one or more of brushes 114.

Alternatively, one or more of brushes 114 may be configured to sweepacross substantially the entire surface of condensation portion 108 toabsorb coagulated refrigerant 116. That is, one or more of brushes 114may be configured to have length so that the brush 114 alwaystransversely sweeps across condensation portion 108; or aretractable/extendable one of brushes 114 may be extended totransversely sweep across condensation portion 108 at scheduledintervals influenced by, e.g., timing, duration, and/or temperaturerange, of heat generating unit 102. The collected droplets of coagulatedrefrigerant 116 may then be transferred to the aforementioned attachedreceptacle or otherwise recycled by, e.g., being reapplied ontoevaporation portion 106 by one or more of brushes 114. Processing maycontinue from block 208 to decision block 210.

Decision block 210 may include a controller of heat dissipating device100, which may be implemented as hardware, software, firmware, or anycombination thereof that is local or remote relative to heat dissipatingdevice 100, determining whether heat dissipating device 100 has servedto sufficiently cool heat generating unit 102, at least for a presenttime.

If the determination at decision block 210 is “no,” i.e., the controllerhas determined that the temperature of heat generating unit 102 has notbeen cooled to an acceptable threshold temperature, processing mayreturn from decision block 210 back to block 206.

If the determination at decision block 210 is “yes,” i.e., thecontroller has determined that the temperature of heat generating unit102 has been cooled to the acceptable threshold temperature, processingmay end, i.e., rest, at least temporarily with an understanding thatsuch rest lasts only until the controller determines that thetemperature of heat generating unit once again rises above theacceptable threshold temperature. Thus, processing may continue fromdecision block 210 to block 212; and further continue, likely, fromblock 212 to decision block 210.

Accordingly, heat dissipating device 100 serves to cool heat generatingunit 102.

With respect to the use of substantially any plural and/or singularterms herein, those having skill in the art can translate from theplural to the singular and/or from the singular to the plural as isappropriate to the context and/or application. The varioussingular/plural permutations may be expressly set forth herein for sakeof clarity.

It may be understood by those within the art that, in general, termsused herein, and especially in the appended claims (e.g., bodies of theappended claims) are generally intended as “open” terms (e.g., the term“including” should be interpreted as “including but not limited to,” theterm “having” should be interpreted as “having at least,” the term“includes” should be interpreted as “includes but is not limited to,”etc.). It will be further understood by those within the art that if aspecific number of an introduced claim recitation is intended, such anintent will be explicitly recited in the claim, and in the absence ofsuch recitation no such intent is present. For example, as an aid tounderstanding, the following appended claims may contain usage of theintroductory phrases at least one and one or more to introduce claimrecitations. However, the use of such phrases should not be construed_toimply that the introduction of a claim recitation by the indefinitearticles “a” or “an” limits any particular claim containing suchintroduced claim recitation to disclosures containing only one suchrecitation, even when the same claim includes the introductory phrasesone or more or at least one and indefinite articles such as “a” or an(e.g., “a” and/or “an” should typically be interpreted to mean “at leastone” or “one or more”); the same holds true for the use of definitearticles used to introduce claim recitations. In addition, even if aspecific number of an introduced claim recitation is explicitly recited,those skilled in the art will recognize that such recitation shouldtypically be interpreted to mean at least the recited number (e.g., thebare recitation of “two recitations,” without other modifiers, typicallymeans at least two recitations, or two or more recitations). In thoseinstances where a convention analogous to “at least one of A, B, or C,etc.” is used, in general such a construction is intended in the senseone having skill in the art would understand the convention (e.g., “asystem having at least one of A, B, or C” would include but not belimited to systems that have A alone, B alone, C alone, A and Btogether, A and C together, B and C together, and/or A, B, and Ctogether, etc.). It will be further understood by those within the artthat virtually any disjunctive word and/or phrase presenting two or morealternative terms, whether in the description, claims, or drawings,should be understood to contemplate the possibilities of including oneof the terms, either of the terms, or both terms. For example, thephrase “A or B” will be understood to include the possibilities of “A”or “B” or “A and B.”

While various aspects and embodiments have been disclosed herein, otheraspects and embodiments will be apparent to those skilled in the art.The various aspects and embodiments disclosed herein are for purposes ofillustration and are not intended to be limiting, with the true scopeand spirit being indicated by the following claims.

We claim:
 1. A heat dissipating device, comprising: a conductive chamberto receive therein a fluid refrigerant, the conductive chamberincluding: an evaporation portion having an upper layer and a lowerlayer that is in contact with a heat generating unit, and a condensationportion; a rotatable brush that is configured inside of the conductivechamber to have an axis that is parallel to the upper layer of theevaporation portion and that is further configured to sweep across theupper layer of the evaporation portion to form a thin film of the fluidrefrigerant, wherein the rotatable brush includes: at least two wheels;and a belt that is configured to have an under layer pass over anexterior surface of the at least two wheels and that is furtherconfigured to have a top layer that has one or more brush elementsattached thereto.
 2. The heat dissipating device of claim 1, wherein atleast one of the at least two wheels is configured to be a drivingwheel, and wherein further an axis of each of the at least two wheels isconfigured to be parallel to each other and to the upper layer of theevaporation portion.
 3. The heat dissipating device of claim 1, whereinthe upper layer of the evaporation portion is configured to have thethin film of the fluid refrigerant absorb heat from the heat generatingunit, and the condensation portion includes an inner layer that isconfigured to have vapor from the heat-absorbed refrigerant coagulatethereon, and wherein the rotatable brush is further configured to sweepacross the inner layer of the condensation portion to collect at leastportions of the coagulated refrigerant.
 4. The heat dissipating deviceof claim 1, wherein the driving wheel is configured to be motor-driven.5. The heat dissipating device of claim 1, wherein the one or more brushelements includes a porous microfiber wiper.
 6. The heat dissipatingdevice of claim 1, wherein the one or more brush elements extends acrossan entire width of the upper layer of the evaporation portion.
 7. Theheat dissipating device of claim 1, wherein the belt includes a porousmicrofiber sheath.
 8. The heat dissipating device of claim 1, whereinthe belt is configured to absorb at least a portion of the coagulatedfluid refrigerant that drops from the inner layer of the condensationportion.
 9. The heat dissipating device of claim 1, wherein therotatable brush is configured to sweep across the upper layer of theevaporation portion at a constant velocity.
 10. The heat dissipatingdevice of claim 1, wherein the one or more brush elements includes aplurality of porous microfiber strands.
 11. The heat dissipating deviceof claim 10, wherein the one or more brush elements is attached to adistal end of a brush stem that is attached to the belt.
 12. The heatdissipating device of claim 1, wherein the condensation portion isconfigured on or as part of a top portion of the conductive chamber andwherein the condensation portion is in contact with an auxiliary heatdissipating device to release heat collected at the condensationportion.
 13. The heat dissipating device of claim 1, wherein the belthas a width that is substantially similar in proportion to a width ofevaporation layer or a width of condensation layer.
 14. The heatdissipating device of claim 1, wherein the belt includes absorbentmaterial.
 15. The heat dissipating device of claim 1, wherein the beltincludes a tacky substance or the at least two wheels include tackysubstance.
 16. The heat dissipating device of claim 1, wherein the oneor more brush elements includes scraper or multitude of strands made ofa microfiber or poly fibers.
 17. A heat dissipating method, comprising:transversely sweeping a rotatable brush across a top layer of a heatedsurface to apply a uniform film of a refrigerant thereon, wherein therotating brush is configured to have an axis that is parallel to the toplayer of the heated surface; and preventing coagulated refrigerant froman inner layer of a condensation surface from dropping onto the toplayer of the heated surface using the rotatable brush, wherein therotatable brush includes: at least two wheels; and a belt that isconfigured to have an under layer pass over an exterior surface of theat least two wheels and that is further configured to have a top layerthat has one or more brush elements attached thereto.
 18. The heatdissipating method of claim 17, wherein the preventing includes rotatingthe brush at a velocity that draws the coagulated refrigerant to droponto the belt.
 19. The heat dissipating method of claim 17, wherein thepreventing includes transversely sweeping the rotatable brush across theinner layer of the condensation surface.
 20. The heat dissipating methodof claim 17, wherein at least one of the at least two wheels isconfigured to be a driving wheel, and wherein further an axis of each ofthe at least two wheels is configured to be parallel to each other andto the upper layer of the evaporation portion.
 21. The heat dissipatingmethod of claim 17, wherein the one or more brush elements includes aporous microfiber wiper.
 22. The heat dissipating method of claim 17,wherein the one or more brush elements extends across an entire width ofthe top layer of the heated surface.
 23. The heat dissipating method ofclaim 17, wherein the belt includes a porous microfiber sheath.
 24. Theheat dissipating method of claim 17, wherein the one or more brushelements includes a plurality of porous microfiber strands.
 25. The heatdissipating method of claim 24, wherein the one or more brush elementsis attached to a distal end of a brush stem that is attached to thebelt.
 26. The heat dissipating method of claim 17, wherein the one ormore brush elements is retractable.
 27. The heat dissipating method ofclaim 17, further comprising, determining whether a temperature iscooled to a threshold temperature.